工作機會 : 科技菁英培訓計畫

與國際接軌,實現您的夢想!!

<以下皆為正式工作職缺>

 

  1. Technical Sales Associate Engineer (All the interview invitation and process will start from June 2012.)
  2. Field Application Associate Engineer - Power field (All the interview invitation and process will start from June 2012.)
  3. Field Application Associate Engineer - Open Multimedia Software field (All the interview invitation and process will start from June 2012.)
  4. Field Application Associate Engineer – Micro-Controller (MCU) field(All the interview invitation and process will start from June 2012.)
  5. Field Application Associate Engineer – Signal Chain (Audio) field (All the interview invitation and process will start from June 2012.)
  6. 請點此下載詳細資訊

1. Technical Sales Associate Engineer

(上班地點:台北, 新竹, 台中或高雄辦公室)

  1. Training & development program briefing:
    • To provide professional development program for new graduates.
    • To develop hi-potential talents to meet competency demand and ranked as qualified sales positions.
    • To enrich end product knowledge and TI product knowledge.
    • To provide on-job trainings by rotated in different Field Application Engineer and Sales teams.
    • To visit headquarters in Dallas, Texas for 3 months (estimated) to explore core business models and reinforce the engagement with TI executives and senior managers.
  2. Work contents, post 6-month training program:
    • Drive TI product design in/win.
    • Identify and provide TI’s total solution to customers.
    • Co-work with FAE, CSR, Disty sales team and worldwide to grow TI sockets and revenue.
  3. Criteria:
    • Bachelor or above Degree with EE background.
    • For male applicants who need to complete military services in advance or military-service free.
    • Strong communication skills is must.
    • Aggressive learning and Self-motivated attitude.
    • Stability in emotion.
    • English Capability.
    • Basic knowledge of Analog or Embedded Processing field will be a plus.
    • Working experiences should be under 2 years.
填寫申請表 TOP

2. Field Application Associate Engineer - Power field

(上班地點:台北或新竹辦公室)

  1. Training & development program briefing:
    • To provide professional development programs to fresh graduates.
    • To develop high potential talents to meet competency demand and ranked as qualified field application engineer positions.
    • To enrich end product knowledge and TI product knowledge, especially in Power products.
    • To provide on-job trainings via support with shadowing program out of senior FAE Team.
    • To visit headquarters in Dallas, Texas for at least 3 months (estimated) to enhance technical skills and network with Business Units and R&Ds..
  2. Work Contents:
    • Provide high caliber power product technical support.
    • Provide application support for field sales and customers.
    • Support and feedback customer requirements to work with Business Unit for new product needs.
    • Demonstrate know-all in DC-DC or AC-DC, power supply topology and support design activities.
    • Handle notebook and portable devices power requirement, measurement and application.
  3. Criteria:
    • Bachelor or above Degree with EE background, major in Power related field or have ever run Power related projects or experiences.
    • For male applicants who need to complete military services in advance or military-service free.
    • Good experience in general data acquisition concept and skills.
    • Good communication skill, team work and fluent in English.
    • Able to handle stress/dead-lines well in a dynamic environment.
    • A good team player.
    • Working experiences should be under 2 years.
填寫申請表 TOP

3. Field Application Associate Engineer - Open Multimedia Software field

(上班地點:台北辦公室)

  1. Training & development program briefing:
    • To provide professional development programs to fresh graduates.
    • To develop high potential talents to meet competency demand and ranked as qualified field application engineer positions.
    • To enrich end product knowledge and TI product knowledge, especially in OMAP Application Processor products.
    • To provide on-job trainings via support with shadowing program out of senior FAE Team.
    • To visit headquarters in Dallas, Texas for at least 3 months (estimated) to enhance technical skills and network with Business Units and R&Ds..
  2. Work Contents:
    • Provide high caliber OMAP Application Processor products technical support.
    • Provide system software support to Smartphone, Tablet and Portable Devices projects.
    • Provide application support to field sales and customers.
    • System SW architecture and SW spec discussion with customers.
    • System SW gap analysis.
    • System SW issues debug and integration.
  3. Criteria:
    • Bachelor or above Degree with EE or CS background, major in Multi-Media/Image processing field or have ever run related projects.
    • For male applicants who need to complete military services in advance or military-service free.
    • Good experience in ARM-Based Embedded System.
    • Good communication skill, team work and fluent in English.
    • Able to handle stress/dead-lines well in a dynamic environment.
    • A good team player.
    • Working experiences should be under 2 years.
填寫申請表 TOP

4. Field Application Associate Engineer – Micro-Controller (MCU) field

(上班地點:台北辦公室)

  1. Training & development program briefing:
    • To provide professional development programs to fresh graduates.
    • To develop high potential talents to meet competency demand and ranked as qualified field application engineer positions.
    • To enrich end product knowledge and TI product knowledge, especially in OMAP Application Processor products.
    • To provide on-job trainings via support with shadowing program out of senior FAE Team.
    • To visit headquarters in Dallas, Texas for at least 3 months (estimated) to enhance technical skills and network with Business Units and R&Ds..
  2. Work Contents:
    • Provide high caliber Micro-Controller product technical support to field sales to solve customers’ problems.
    • Debug and design firm ware and hardware.
    • Support and feedback customer requirements to work with Business Unit for new product needs.
    • Project management
  3. Criteria:
    • Bachelor or above Degree with EE or CS background, with Motor-Control or Micro-Controller related projects or experiences.
    • For male applicants who need to complete military services in advance or military-service free.
    • Good communication skill, team work and fluent in English.
    • Able to handle stress/dead-lines well in a dynamic environment.
    • Working experiences should be under 2 years.
填寫申請表 TOP

5. Field Application Associate Engineer – Signal Chain (Audio) field

(上班地點:台北辦公室)

  1. Training & development program briefing:
    • To provide professional development programs to fresh graduates.
    • To develop high potential talents to meet competency demand and ranked as qualified field application engineer positions.
    • To enrich end product knowledge and TI product knowledge, especially in Audio products.
    • To provide on-job trainings via support with shadowing program out of senior FAE Team.
    • To visit headquarters in Dallas, Texas for at least 3 months (estimated) to enhance technical skills and network with Business Units and R&Ds..
  2. Work Contents:
    • To provide audio product technical support.
    • To provide application support for field sales and customers.
    • To support and feedback customer requirements to work with business unit for new product needs.
    • To promote TI audio products.
    • To work with sales, marketing, system engineer, application engineer, distributors etc. to win business.
  3. Criteria:
    • MSEE and above with or without working experience, BSEE with 1~2 years experience or above in EE application or design tasks.
    • For male applicants who need to complete military services in advance or military-service free.
    • Good experience in general data acquisition concept and skills.
    • Good communication skill, team work and fluent in English.
    • Able to handle stress/dead-lines well in a dynamic environment.
    • Self-motivated person and a good team player.
填寫申請表 TOP


TI 最新產品 / 下載

TPS54620 - 最輕巧的 6-A﹐17-V DC/DC。封裝尺寸比多晶片轉換器縮減 60%﹐總面 積小於195mm²﹐高效能1.6-MHz POL 設計。



TI 的 CC2530 為一真正晶片系統解決方案,專為 IEEE 802.15.4、ZigBee、ZigBee RF4CE 與 Smart Energy 應用量身訂做。