線上適性測驗

優質人才招募

  1. IC Technical Sales Engineer (Analog Products) 技術行銷工程師 (類比產品)
  2. DSP Technical Sales Engineer 技術行銷工程師
  3. HPA Power Application Engineer 類比電源應用工程師
  4. Packaging Engineer 封裝工程師
  5. Test Development Engineer 測試開發工程師
  6. Product Test Engineer 產品測試工程師
  7. Process Engineer 製程工程師
  8. Equipment Engineer 設備工程師

1. IC Technical Sales Engineer (Analog Products) 技術行銷工程師 (類比產品)

(上班地點:台北)

  • BSEE degree or above.
  • Responsible for customer design-in and design-win.
  • Min 2 years in Analog field.
  • Good at communicatin skills.
  • Initiate new product idea of TI potential TI produts for Taiwan market.
  • Approach TI Analog product solution to Taiwan-based customers.
  • Work with FAE to support VAR
  • Gain TI-USA and TI-Japan support to fulfill cusstomer's request.
  • Working experience in semiconductor industry and with Analog products is plus.
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2. DSP Technical Sales Engineer 技術行銷工程師 (消費性電子產品)

(上班地點:台北辦公室)

  • Promote TI DSP solution to Taiwan ODM customers.
  • Work with FAE to support customers.
  • Account management and Gain TI-USA and TI-Japan support to fulfill customer's request.
  • Bachelor and/or Master Degree of Electric Engineering.
  • Above 3 years Professional Experience.
  • EE background on consumer electronic products, such as digital imaging, digital still camera, DV.
  • Working experience in digital still camera or DSP-related field is a plus.
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3. HPA Power Application Engineer 類比電源應用工程師

(上班地點:台北)

  1. Primary Responsibilities:
    • Responsible for SPM ( system power management ) products support; mainly for NB's system power ( Vcore, system & charger solutions ) to key NB customers.
    • Working experience should be in the area of portable application or SMPS application at his/her role should be R&D for at least 3~5years.
    • Had design experience in using NB's system power, or traditional PWM controller for DC-DC , AC-DC power conversion.
    • To co-work with team in other area like PPM ( portable power management ) & PIP ( Plug in Power ) space.
    • Support and feedback customer requirement to SBE for new product needs.
  2. Others Abilities:
    • BS/MS in EE.
    • Fluent in English.
    • Professional experience above 3 yrs.
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4. Packaging Engineer 封裝工程師

(上班地點:中和)

  • Sophisticated experience at packaging process, equipment and quality control to cover operation for new package projects and wafer technology.
  • Conduct DOE to do trouble shooting and advanced technology development.
  • Work with internal and external resources to run technical programs with project management skills.
  • Communicate with suppliers and TI WW team in English for packaging projects 5.Preferred to have other assembly process experience.
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5. Test Development Engineer 測試開發工程師

(上班地點:中和)

  1. Criteria:
    • BS above, major in EE, Communication Engineering or Electrical and Control Engineering.
  2. Job content:
    • Develop test program for IC chip in Wireless/DVD/Hard disk/ADC/DAC/ETC....
    • To define SCM -Define test strategy, fully understand device specification and design blocks.
    • Independently develop and debug characterization, qualification and production test program for packaged devices of wafers.
    • Generate test plan, design test hardware and debug silicon.
    • Communicate with designer and customer.
  • Experience in test programming will be a plus.
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6. Product Test Engineer 產品測試工程師

(上班地點:中和)

  1. Criteria:
    • BS above, major in EE, Communication Engineering or Electrical and Control Engineering.
  2. Job content:
    • Responsible for a specific product or group of products, debug of programs/test board/tester instruments, and provide solutions to development team to fix the issue.
    • Working with tester & equipment engineer and Communication with related departments (LBE).
    • Besides, yield improvement (wafer process & customer spec requirement), test time reduction (test program method improvement), tester platform conversion.
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7. Process Engineer 製程工程師

(上班地點:中和)

  1. Criteria:
    • BS above, major in ME, IE, Physics or Chemical Engineering.
  2. Job content:
    • Yield/Quality analysis and improvement
    • Customer return analysis and abnormal lot disposition
    • Interface between A/T and other sites (Probe or FAB sites)
    • Project management
    • Equipment survey and benchmarking
    • New process development
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8. Equipment Engineer 設備工程師

(上班地點:中和)

  1. Criteria:
    • BS above, major in ME or EE.
  2. Job content:
    • Responsible for evaluating, selecting, and ordering equipment that is most appropriate and cost effective for the manufacture of company products.
    • Oversees the installation, modification, upgrade and maintenance of manufacturing equipment.
    • Keeps current on technical notices, upgrades and safety issues.
    • Studies equipment performance and reliability.
    • Establishes programs and solutions for increasing uptime and for equipment problems that affect the manufacturing process.
    • Defines, writes and audits the preventative maintenance specification and schedules per TS16949 required.
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